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| MA4AGSBP907 AlGaAs Solder Bump Flip-Chip PIN Diode RoHS Compliant Rev. V4 Features Mounting Side with Solder Bumps Low Series Resistance Ultra Low Capacitance Millimeter Wave Switching & Cutoff Frequency 2 Nanosecond Switching Speed Can be Driven by a Buffered TTL Silicon Nitride Passivation Polyimide Scratch Protection RoHS Compliant Solderable Bump Die Attach Description M/A-COM's MA4AGSBP907 is an aluminum gallium arsenide flip-chip PIN diode with solder bumps. These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. The diodes exhibit an extremely low RC product, 0.1ps and 2nS switching characteristics. The useable frequency range is 100MHz to 40GHz. They are fully passivated with silicon nitride and have an additional layer of a polymer for scratch protection. The protective coating prevents damage to the junction and the anode airbridge during handling and circuit attachment. Absolute Maximum Ratings @ TAMB = 25C (unless otherwise specified) Parameter Reverse Voltage Operating Temperature Storage Temperature Junction Temperature Dissipated Power ( RF & DC ) Absolute Maximum -50V -55C to +125C -55C to +150C +175C 50mW Applications The 25fF capacitance of the MA4AGSBP907 allows usage through millimeter frequencies for RF switches and switched phase shifter applications. This diode is designed for use in pulsed or CW applications, where single digit nanosecond switching speed is required. For surface mount assembly, the low capacitance of the MA4AGSBP907 makes it ideal for use in microwave multi-throw switch assemblies, where the series capacitance of each "off" port adversely loads the input and affects VSWR. C.W. Incident Power Mounting Temperature +23 dBm +280C for 10 seconds 1 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4AGSBP907 AlGaAs Solder Bump Flip-Chip PIN Diode RoHS Compliant Rev. V4 Electrical Specifications at TAMB = 25C 1MHz & DC Specs. 10GHz Reference Data Typ. 0.025 4.2 1 2 Parameters and Test Conditions Total Capacitance at -10V Series Resistance at +10mA Forward Voltage at +10mA Reverse Breakdown Voltage at 10A Switching Speed 4 10 to 90% RF Voltage 90 to 10% RF Voltage 4 3 Symbol Ct Rs VF VB TRISE TFALL Units Typ. pF Volts Volts nS Max. 0.030 7.0 1.45 50 ----- 0.025 5.2 1.33 45 ----- --------- 2 Notes: 1. Capacitance is determined by measuring single series diode isolation in a 50 line at 10GHz. 2. Forward series resistance is determined by measuring single series diode insertion loss in a 50 line at 10GHz. 3. Reverse current will not exceed 10A at the maximum voltage rating. 4. Switching speed is measured between 10% to 90% or 90% to10% RF voltage for a single series mounted diode. driver delay is not included. INCHES DIM A B C D E F MIN. 0.026 0.0135 0.0065 0.0043 0.0068 0.0182 MAX. 0.027 0.0145 0.0075 0.0053 0.0073 0.0192 MIN. 0.6604 0.3429 0.1651 0.1092 0.1727 0.4623 MM MAX. 0.6858 0.3683 0.1905 0.1346 0.1854 0.4877 Circuit Pad Layout 0.013" 0.012" (2) PL Note: 1. Yellow areas indicate solder bumps. 2 0.008" (2) PL ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4AGSBP907 AlGaAs Solder Bump Flip-Chip PIN Diode RoHS Compliant Rev. V4 Electrical Specifications @ TAMB = 25C (unless otherwise noted) Single Series Diode Insertion Loss vs. Frequency I. Loss @5mA 0.0 I. Loss @15mA I. Loss @50mA Insertion Loss (dB) -0.2 -0.4 -0.6 -0.8 -1.0 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Frequency (GHz) Frequency ( G Hz ) Single Series Diode Return Loss vs. Frequency R. Loss @5mA R. Loss @15mA R. Loss @50mA -20.0 -22.0 -24.0 Return Loss (dB) -26.0 -28.0 -30.0 -32.0 -34.0 -36.0 -38.0 -40.0 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Frequency (GHz) 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4AGSBP907 AlGaAs Solder Bump Flip-Chip PIN Diode RoHS Compliant Rev. V4 Electrical Specifications @ TA = 25C (unless otherwise noted) Single Series Diode Isolation vs. Frequency Isolation @ -10V -5.0 Isolation @ 0V Isolation @ -1V -10.0 Isolation (dB) -15.0 -20.0 -25.0 -30.0 -35.0 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Frequency (GHz) 4 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. MA4AGSBP907 AlGaAs Solder Bump Flip-Chip PIN Diode RoHS Compliant Rev. V4 Device Installation Guidelines The following guidelines should be observed to avoid damaging the AlGaAs flip-chips. Cleanliness These devices should be handled in a clean environment. Static Sensitivity Aluminum gallium arsenide PIN diodes are ESD sensitive and can be damaged by static electricity. Proper ESD techniques should be used when handling these devices. These devices are rated Class 0, (0-199V) per HBM MIL-STD-883, method 3015.7 [C = 100pF10%, R = 1.5kW1%]. Even though tested die pass 50V ESD, they must be handled in a static-free environment. General Handling These devices have a polymer layer which provides scratch protection for the junction area and the anode air bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum pencil. Assembly Requirements using Tin / Lead Solder The flip chip diode employs a 6m thick, Sn/Pb, 63/37 solderable interface as part of the 50m high solder bump. These chips are designed to be soldered onto hard or soft substrates with the junction side down. They should be mounted onto silkscreened circuits using 63/37 Sn/Pb solder paste. A typical profile for a Sn/Pb 63/37 soldering process is provided in on the M/A-COM website at this address: http://www.macom.com/ Application%20Notes/pdf/M538.pdf. Ordering Information Part Number MA4AGSBP907 Packaging Die in Carrier 5 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed. changes to the product(s) or information contained herein without notice. |
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